This article's factual accuracy may be compromised due to out-of-date information. Please help update this article to reflect recent events or newly available information.(September 2012)
LGA 1356 has 1356 protruding pins to make contact with the pads on the processor. Processors of LGA 1356 and LGA 1366 sockets are not compatible with each other since they have different socket notches.
While LGA 2011 was designed for high-end desktops and high-performance servers, LGA 1356 was designed for the dual-processor and low-end segment of the server market.
It supports 64-bit wide DDR3 triple channel memory, and equipped with 1 Intel QPI connection and 24 PCI Express lanes. Meanwhile LGA 2011 supports quad channel memory, 2 QPI connections and 40 PCIe lanes. Socket LGA 1155, desktop socket of the same generation supports dual channel memory. Each DDR3 channel can support one more DIMM (only applicable to DDR3 and not DDR3-L).[2]
Plans were leaked in early 2011, with estimated releases in the first quarter of 2012.[3]
In September 2011, releases were estimated to be at the end of the first quarter of 2012.[4]
Physical design
Socket B2 processors have the following mechanical maximum load limits which should not be exceeded during heatsink assembly, shipping conditions, or standard use. Load above those limits will crack the processor die and make it unusable. The limits are included in the table below.
^Hiroshige Goto (April 9, 2010). "Sandy Bridge Interface"(PDF). PC Watch website. Archived from the original(PDF) on September 28, 2011. Retrieved November 12, 2011.