List of Intel Atom processors
Intel Atom is Intel 's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors . Atom, with codenames of Silverthorne Diamondville
For nettop and netbook Atom microprocessors after Diamondville , the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.
Nettop processors (small desktop)All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , Intel 64 , XD bit (an NX bit implementation), Hyper-Threading
Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller[ 1]
Transistors: 123 million (single-core), 176 million (dual-core)
Die size: 66 mm2 (9.56 × 6.89) (single-core), 87 mm2 (9.56 × 9.06) (dual core)
Package size: 22 mm × 22 mm
Saltwell microarchitecture
Intel Atom N455 All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , Intel 64 , Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB[ 4]
Transistors: 123 million (single-core), 176 million (dual-core)
Die size: 66 mm2 (9.56 × 6.89) (single-core), 87 mm2 (9.56 × 9.06) (dual core)
Package size: 22 mm × 22 mm
Saltwell microarchitecture
All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x
Model Z515 supports Intel Burst Performance Technology
Uses the Poulsbo chipset.
Transistors: 47 million
Die size: 26 mm2
Package size: 13 mm × 14 mm / 22 mm × 22 mm (processors ending with the P or PT sSpec number) All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading . All except Z605 support Intel Burst Performance Technology (BPT).
GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor.[ 5] Transistors: 140 million
Die size: 7.34 mm × 8.89 mm = 65.2526 mm2
Package size: 13.8 mm × 13.8 × 1.0 mm
Steppings: C0
Saltwell microarchitecture
All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Hyper-Threading .
Integrated PowerVR SGX 540 GPU and DDR3 single-channel memory controller
Package size: 12 mm × 12 × 1.0 mm
Transistors: 140 million
Die size: 65.2526 mm2 (7.34 mm x 8.89 mm) All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel VT-x , AES-NI , Intel Burst Performance Technology (BPT).
Z3480 also supports Intel Wireless Display .
Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5
Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G
Package size: 12 mm × 12 × 1.0 mm All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel VT-x , AES-NI , Intel Burst Performance Technology (BPT), Intel Wireless Display .
GPU (PowerVR G6430 ) and memory controller are integrated onto the processor die
Package size: 14 mm × 14 × 1.0 mm SoFIA (smart or feature phone with Intel architecture )[ 6]
All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x , AES-NI (based on Silvermont's specs)
GPU (ARM Mali ) and memory controller are integrated onto the processor die
Package size: 34 × 40 mm
SoFIA 3G SoC with Silvermont CPU
Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3130)[ 7]
SoFIA 3G–R SoC with Silvermont CPU
Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3230RK)[ 7]
SoFIA LTE (W) with Airmont CPU (Announced, but never launched)
Integrated LTE Cat. 4 (XG726-based), SMARTi 4.5, LnP/ CG2000, PMIC (Atom x3-C3440 & C3445)[ 7]
All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading . All except Z605 support Intel Burst Performance Technology (BPT).
GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die[ 5] Transistors: 140 million
Die size: 7.34 mm × 8.89 mm = 65.2526 mm2
Package size: 13.8 mm × 13.8 × 1.0 mm
Steppings: C0
Saltwell microarchitecture
Intel Atom Z2760 Saltwell die shot All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading , Intel Burst Performance Technology (BPT).
GPU and memory controller are integrated onto the processor die
Package size: 13.8 mm × 13.8 × 1.0 mm
Steppings:B1, C0 No official TDP available. For power data see[ 8]
Intel Atom Z3735E Bay Trail (Silvermont) Die Shot All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x , AES-NI , TXT/TXE
Package size: 17 mm × 17 × 1.0 mm Type 4 SoC:[ 9]
DDR3L single-channel or LPDDR3 dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)
Integrated Intel HD Graphics (Gen7) GPU
One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)
One USB 2.0 controller supporting four ports
Integrated LPE audio controller
Integrated image signal processor supporting two MIPI CSI ports, 24 MP sensors, and stereoscopic video
Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
Serial I/O supporting SPI, UART (serial port), I2C or PWM Type 3 SoC:
DDR3L/L-RS single-channel memory controller supporting up to 2 GB
Display controller with 1 MIPI DSI port and 2 DDI ports (HDMI 1.4)
Integrated Intel HD Graphics (Gen7) GPU
One USB controller supporting two USB 2.0 ports
Integrated LPE audio controller
Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors
Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
Serial I/O supporting SPI, UART (serial port), I2C or PWM All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel VT-x 2 (VT-x with EPT , FlexMigration, FlexPriority and VPID[ 10] [ 11] AES-NI .,[ 12] TXT/TXE
Package size: 17 mm × 17 × 1.0 mm Type 4 SoC:[ 9]
LPDDR3 dual-channel memory controller supporting up to 8 GB
PCI Express 2.0 controller with 2 lanes
Display controller with 2 MIPI DSI ports and 3 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)
Integrated Intel HD Graphics (Gen8) GPU
One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports
One USB xDCI controller supporting one USB 3.0 port
Integrated LPE audio controller
Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors
Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
Serial I/O supporting SPI, UART (serial port), I2C or PWM Type 3 SoC:
DDR3L/L-RS single-channel memory controller supporting up to 2 GB
PCI Express 2.0 controller with 1 lane
Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)
Integrated Intel HD Graphics (Gen8) GPU
One USB controller supporting three USB 2.0 ports and two HSIC ports
Integrated LPE audio controller
Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors
Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
Serial I/O supporting SPI, UART (serial port), I2C or PWM CPU core supports IA-32 architecture, MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), hyper-threading , Intel VT-x .
Package size: 22 mm × 22 mm
Steppings: B0
Temperature range: for (E620, E640, E660, E680): 0 °C to +70 °C, for (E620T, E640T, E660T, E680T): -40 °C to +85 °C.
DDR2 single-channel memory controller supporting up to 2 GB
PCI Express 1.0a controller with 4 lanes
Display controller with LVDS and serial DVO ports
Integrated GMA600 (PowerVR) GPU
Integrated HD audio controller
Serial I/O supporting SPI "Tunnel Creek " CPU with an Altera Field Programmable Gate Array (FPGA)
CPU core supports IA-32 architecture, MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading , Intel VT-x
Package size: 37.5 mm × 37.5 mm
Steppings: B0
TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
Temperature range: for (E625C, E645C, E665C): 0 °C to +70 °C, for (E625CT, E645CT, E665CT): -40 °C to +85 °C.
DDR2 single-channel memory controller supporting up to 2 GB
PCI Express 1.0a controller with 4 lanes
Display controller with LVDS and serial DVO ports
Integrated GMA600 (PowerVR) GPU
Integrated HD audio controller
Serial I/O supporting SPI All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel VT-x , AES-NI , TXT/TXE
Package size: 25 mm × 27 mm
DDR3L dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
Display controller with 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)
Integrated Intel HD Graphics (Gen7) GPU
PCI Express 2.0 controller with four lanes and four root ports
Two SATA-300 ports
One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)
One USB 2.0 controller supporting four ports
Integrated LPE and HD audio controllers
Integrated image signal processor supporting three MIPI CSI ports, 24 MP sensors, and stereoscopic video
Integrated memory card reader supporting SDIO 3.0, eMMC 4.5, and SDXC
Serial I/O supporting SPI, UART (serial port), I2C or PWM All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel VT-x , AES-NI .
GPU and memory controller are integrated onto the processor die
GPU is based on Broadwell Intel HD Graphics , with 12 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
Package size: 25 mm × 27 mm All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel VT-x , Intel VT-d , AES-NI , TXT/TXE
Package size: 24 mm × 31 mm
DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB; support for DDR3L with ECC
Display controller with 1 MIPI DSI port and 2 DDI ports (eDP 1.3, DP 1.1a, or HDMI 1.4b)
Integrated Intel HD Graphics (Gen9) GPU
PCI Express 2.0 controller supporting 6 lanes (3 dedicated and 3 multiplexed with USB 3.0); 4 lanes available externally
Two USB 3.0 ports (1 dual role, 1 dedicated, 3 multiplexed with PCI Express 2.0 and 1 multiplexed with one SATA-300 port)
Two USB 2.0 ports
Two SATA-600 ports (one multiplexed with USB 3.0)
Integrated HD audio controller
Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors
Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0
Serial I/O supporting SPI, HSUART (serial port) and I2C All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Intel 64 , XD bit (an NX bit implementation), Intel VT-x , Intel VT-d , AES-NI .
GPU is based on Gen11 Intel HD Graphics , with up to 32 execution units, and supports up to 3 displays (4K @ 60 Hz) through HDMI , DP , eDP, or DSI .
SoC peripherals include 4 × USB 2.0/3.0/3.1, 2 × SATA , 3 × 2.5GbE LAN , UART , and up to 8 lanes of PCI Express 3.0 in x4, x2, and x1 configurations.Package size: 35 mm × 24 mm
In Q2 2024 Intel launched these cpus: Atom® x7203C, Atom® x7211RE, Atom® x7213RE, Atom® x7405C, Atom® x7433RE, Atom® x7809C, Atom® x7835RE. These processors have 2-8 cpu cores and use 6-25 watts of power.[ 13]
All Atom server processors include ECC support.
All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost , Intel 64 (according to Datasheet), XD bit (an NX bit implementation), Intel VT-x , AES-NI , ECC memory .
Dual-core SoC peripherals include 4 × USB 2.0, 2 × SATA , 2 × Integrated GbE LAN , 2 × UART , and 4 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
Quad-core SoC peripherals include 4 × USB 2.0, 2 (C2530) or 6 (C2550) × SATA , 2 × Integrated GbE LAN , 2 × UART , and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
C2730 SoC peripherals include 4 × USB 2.0, 2 × SATA , 2 × Integrated GbE LAN , 2 × UART , and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
C2750 SoC peripherals include 4 × USB 2.0, 6 × SATA , 4 × Integrated GbE LAN , 2 × UART , and 16 lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations.
Package size: 34 mm × 28 mm
Die size: 107 mm2 All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost , Intel 64 , XD bit (an NX bit implementation), Intel VT-x , AES-NI , ECC memory .
All models except C2x38 support Intel QuickAssist Technology (cryptography accelerator)
SoC peripherals include 4 × USB 2.0, 4-6 × SATA (1 for C2308, 2 for C2316, C2508, C2516), 4 × Integrated GbE LAN (2 for C2316), 2 × UART , and 8-16 lanes of PCI Express 2.0 (4 lanes for C2308), in x16, x8, x4, x2, and x1 configurations.Package size: 34 mm × 28 mm All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost (dual-core, C3xx0, C3xx5 only), Intel 64 , XD bit (an NX bit implementation), Intel VT-x , Intel VT-d , AES-NI , ECC memory .
SoC peripherals include 8–16 × USB 3.0, 6–16 × SATA , 4 × Integrated 1GbE , 2.5GbE , and 10GbE (C3538 and up) LAN , and up to 20 lanes of PCI Express 3.0, in x8, x4, and x2 configurations.Package size: 34 mm × 28 mm All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Intel 64 , XD bit (an NX bit implementation), Intel VT-x , AES-NI , ECC memory .
Same frequency for all models: 2.2 GHz. L2 cache: 4.5 MB per module; each module comprises four CPU cores.
SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA , Integrated Intel Ethernet 800 series 100 Gbit/s LAN , 3 × UART , and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations.Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT)[ 14]
P####B models are designed for base transceiver stations , especially that for 5G networks. All other models are designed for communications (extended temperature range).
Package size: 47.5 mm × 47.5 mm All models support: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , Intel 64 , XD bit (an NX bit implementation), Intel VT-x , AES-NI , ECC memory .
SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA , Integrated Intel Ethernet 800 series 100 Gbit/s LAN (except 51xx model numbers), 3 × UART , and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations.Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT)[ 14]
Model numbers ending in 0 are extended temperature range; model numbers ending in 5 are commercial temperature range.
Package size: 47.5 mm × 47.5 mm For other earlier (not Atom branded) Intel CE SoCs, see
Olo River (CE 2110) and
Canmore (CE 3100).
Single-core CE SoCs
[ 15]
Package size: 27 mm × 27 mm
GPU (based on the PowerVR SGX535 from Imagination Technologies) CE4200[ 16]
Package size: ?? mm × ?? mm
2 × 32-bit memory channels, up to DDR2-800
GPU (based on the PowerVR SGX535 from Imagination Technologies)
Dual-Core CE SoCs
[ 17] [ 18] [ 19]
See also
References
^ "Intel® Atom™ Processor D400 and D500 Series Datasheet- Volume One" (PDF) . Intel .^ a b "Data sheet" (PDF) . Intel .^ Intel (February 3, 2014). "Product Change Notification #112810 - 00" (PDF) . Intel.com. Retrieved April 5, 2015 . ^ "Data sheet" (PDF) . Intel .^ a b "Data sheet" (PDF) . Intel .^ "Intel shows budget Android phone powering big-screen Linux • The Register" . The Register ^ a b c Rockchip#Tablet processors with integrated modem ^ Data sheet Intel^ a b Data sheet Intel^ "What exactly is VT-x2?" . Software.intel.com. March 30, 2009. Retrieved April 22, 2016 .^ Virtualization technology Intel^ "Intel Atom Processor Z8000 Series Datasheet, Vol. 1" . Ssl.intel.com. Retrieved April 22, 2016 .^ "amston lake intel ark" .^ a b "Intel® QuickAssist Technology (Intel® QAT) Improves Data Center" . Intel.com. Retrieved March 17, 2022 .^ "Intel Atom Processor CE4100 Product Brief" (PDF) . Retrieved March 27, 2024 .^ "Intel Unveils Atom CE4200, Atom E600 Processors and IntelAppUp | TechHail" . www.techhail.org . September 16, 2010.^ "New Choices for Consumers with Intel Silicon in Set-Top Boxes and Media Gateways" . Archived from the original on April 2, 2016. Retrieved January 28, 2013 .^ "Intel's Berryville Atom CE processors revealed" . Retrieved March 27, 2024 .^ "Intel launches new CE5300 series media processors" . www.cpu-world.com .
External links
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